Capabilities
Specifications |
Standard Technology |
Advanced Technology |
Number of Layers |
1 - 12 |
14 - 40 |
Board Material |
FR4 FR406 IS410
|
Aluminum Core Arlon CEM Copper Core FR408 Getek Nelco 4000 Taconic TLY Polyimide |
Minimum Board Thickness |
2 layer – 0.010" 4 layer – 0.020" 6 layer – 0.020" 8 layer – 0.062" 10 layer – 0.062" 12 layer – 0.062" |
2 layer – 0.005" 4 layer – 0.010" 6 layer – 0.031" 8 layer – 0.040"
|
Maximum Board Thickness |
2 layer – 0.125" 3-12 layer – 0.200" |
0.250" |
Maximum Board Size |
16" x 22" 12" x 21" 22" x 26" |
10" x 16" 16" x 22" 12" x 21" 22" x 26" |
Copper Thickness |
0.5 oz - 4 oz |
0.25 oz - 6 oz |
Hole Aspect Ratio |
6 : 1 |
15 : 1 |
Minimum Hole Size |
0.008" |
0.006" |
Minimum Trace/Space |
0.006"/0.006" |
0.003"/0.003" |
Minimum Drill-to-Copper |
0.010" |
0.006" |
Minimum Pitch |
1 mm |
0.5 mm |
Final Finish |
HASL (Solder) Copper Gold Gold Fingers White Tin OSP |
HASL Gold (ENIG/Hard/Soft) Selective Gold Immersion Silver OSP White Tin |
Solder Mask |
LPI: Green Black Red Blue Yellow White Clear |
LPI: Green Black Red Blue Yellow White Clear Mix-and-match Wet Mask Dry Film |
Silk Screen |
White Black Yellow |
White Black Yellow Red |
Fabrication |
Scoring Route & Retain |
Scoring Jump Scoring Route & Retain Milling |
Additional Features |
Plated Slots Non-plated Slots Controlled Dielectric Covered Vias Counter Sinks Counter Bores |
Plated Edges Controlled Impedance Silver Filled Vias
|
Quality Standards |
IPC 6012 Class 2 Electrical Testing |
Milspec 31032 Milspec 55110 Milspec 50884 IPC 6012 Class 3 100% Netlist Testing TDR Testing |
Special Technology |
|
Blind & Buried Vias Metal Core Boards Burn-in Board Flex and Rigid-Flex |